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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9716249 B1

PDFFull Text
Date of Patent:
Jul. 25, 2017

Filed:

May. 02, 2016

Display module encapsulating structure and preparing method thereof

Applicant:

Everdisplay Optronics (Shanghai) Limited, Shanghai, CN;

Inventors:

Hsinju Ho, Shanghai, CN;

Chienlin Wu, Shanghai, CN;

Huan Jiang, Shanghai, CN;

Assignee:

EVERDISPLAY OPTRONICS (SHANGHAI) LIMITED, Shanghai, CN;

Attorneys:

Andrew F. Young, Esq.

Lackenbach Siegel, LLP

Primary Examiner:

Tan N Tran

Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 51/52 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01); H01L 29/786 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5256 (2013.01); H01L 27/323 (2013.01); H01L 27/3244 (2013.01); H01L 27/3246 (2013.01); H01L 27/3262 (2013.01); H01L 27/3281 (2013.01); H01L 29/78672 (2013.01); H01L 51/004 (2013.01); H01L 51/0035 (2013.01); H01L 51/0096 (2013.01); H01L 51/524 (2013.01); H01L 51/5237 (2013.01); H01L 51/5253 (2013.01); H01L 51/5262 (2013.01); H01L 51/56 (2013.01); H01L 51/0034 (2013.01); H01L 2227/323 (2013.01); H01L 2251/301 (2013.01); H01L 2251/303 (2013.01); H01L 2251/558 (2013.01);
Abstract

A display module encapsulating structure and preparation method thereof, which relates to the field of display devices and can be applied to preparing AMOLED and other related display devices as described in the application, mainly use the thin film encapsulation structure to hermetically protect the display module (such as OLED display module), that is sealing the display module by inorganic thin film layer having the characteristics of transparency as well as containing moisture-resistance and oxygen-resistance; buffering the internal and external stresses of the thin film layers and restraining the falling off of the layers caused by the bending stress when preparing flexible devices. Meanwhile, the raised features formed by multilayer stack can effectively inhibit the diffusion effect of inorganic coating and increase the number of side water retaining walls of thin film device, therefore, effectively improve the encapsulating effect.

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