The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2017
Filed:
May. 02, 2012
Applicant:
Dipak Sengupta, Boxborough, MA (US);
Inventor:
Dipak Sengupta, Boxborough, MA (US);
Assignee:
ANALOG DEVICES, INC., Norwood, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/04 (2014.01); H01L 25/16 (2006.01); H01L 31/12 (2006.01); H01L 31/02 (2006.01); G02B 6/42 (2006.01); H01L 31/0232 (2014.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
H01L 31/02325 (2013.01); G02B 6/423 (2013.01); H01L 31/0203 (2013.01); G02B 6/4201 (2013.01); G02B 6/4228 (2013.01); H01L 25/041 (2013.01); H01L 25/167 (2013.01); H01L 31/02002 (2013.01); H01L 31/02016 (2013.01); H01L 31/12 (2013.01);
Abstract
An integrated optical sensor module includes an optical sensor die having an optical sensing area on its first surface, and an application-specific integrated circuit (ASIC) die arranged over the first surface of the optical sensor die. A hole in the ASIC die is at least partially aligned with the optical sensing area such that at least some of the light passing through the hole may contact the optical sensing area. The hole through the ASIC die can be configured to receive an optical fiber, lens structure, or other optical element therein.