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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9716085 B1

PDFFull Text
Date of Patent:
Jul. 25, 2017

Filed:

Oct. 28, 2016

Method for manufacturing a light emitted diode display

Applicant:

Sct Technology, Ltd., Grand Cayman, KY;

Inventors:

Eric Li, Milpitas, CA (US);

Heng Liu, Sunnyvale, CA (US);

Sheanyih Chiou, San Jose, CA (US);

Assignee:

SCT TECHNOLOGY, LTD., Grand Cayman, KY;

Attorneys:

Novick, Kim & Lee, PLLC

Allen Xue

Primary Examiner:

Robert Bachner

Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/66 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/67144 (2013.01); H01L 21/6831 (2013.01); H01L 21/6838 (2013.01); H01L 22/20 (2013.01); H01L 24/00 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 33/0079 (2013.01); H01L 27/156 (2013.01); H01L 33/0095 (2013.01); H01L 33/62 (2013.01);
Abstract

A method for manufacturing a micro LED display is provided. The method includes providing a plurality of LED elements on a first substrate, transferring, using a magnetic holder or a vacuum holder, at least two of the plurality of LED elements of the same primary color from the first substrate to a second substrate, performing the steps of the providing and the transferring with respect to three primary colors, forming an array of RGB LED units on the second substrate, each of the array of RGB LED units including a red LED element, a green LED element, and a blue LED element, interposing the array of RGB LED units between the second substrate and an LED driver wafer, detaching the second substrate from the array of RGB LED units, and interposing the array of RGB LED units between the LED driver wafer and a cover.

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