The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2017

Filed:

Feb. 17, 2012
Applicants:

Ravi Palaniswamy, Singapore, SG;

Arokiaraj Jesudoss, Singapore, SG;

Alejandro Aldrin IL Agcaoili Narag, Singapore, SG;

Siang Sin Foo, Singapore, SG;

Fong Liang Tan, Singapore, SG;

Wei Meng Pee, Singapore, SG;

Andrew J. Ouderkirk, St. Paul, MN (US);

Justine A. Mooney, Austin, TX (US);

Inventors:

Ravi Palaniswamy, Singapore, SG;

Arokiaraj Jesudoss, Singapore, SG;

Alejandro Aldrin Il Agcaoili Narag, Singapore, SG;

Siang Sin Foo, Singapore, SG;

Fong Liang Tan, Singapore, SG;

Wei Meng Pee, Singapore, SG;

Andrew J. Ouderkirk, St. Paul, MN (US);

Justine A. Mooney, Austin, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 23/498 (2013.01); H01L 23/49838 (2013.01); H01L 23/49872 (2013.01); H01L 24/17 (2013.01); H01L 33/62 (2013.01); H05K 1/112 (2013.01); H01L 33/486 (2013.01); H01L 33/641 (2013.01); H01L 33/647 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01); H05K 1/189 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.


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