Resin composition, cured film, laminated film, and method for manufacturing semiconductor device

Abstract

[Problem] To provide a highly heat resistant resin composition which exhibits good tackiness at low temperatures less than or equal to 180° C., and whose production of a volatile portion due to decomposition or the like is small even at high temperatures greater than or equal to 250° C., and whose increase in adhesive force is small even after passage through a heat treatment step, and therefore which allows a base material to be easily peeled off at room temperature when the base material is to be peeled off, and a cured membrane and a laminate film that employ this resin composition. [Solution Means] A resin composition containing a polyimide-based resin and a methylol-based compound, the resin composition being characterized in that the polyimide-based resin has an acid dianhydride residue and a diamine residue, and has as the diamine residue at least a residue of a polysiloxane-based diamine represented by General formula (1) and a residue of an aromatic diamine having a hydroxyl group, and a cured product and a laminate film that employ this resin composition. (n is a natural number, and an average value thereof calculated from an average molecular weight of the polysiloxane-based diamine is in a range of 5 to 30. Rand Rmay be individually the same or different, indicating an alkylene group or a phenylene group whose carbon number is 1 to 30. Rto Rmay be individually the same or different, indicating an alkyl group, a phenyl group or a phenoxy group whose carbon number is 1 to 30.)