The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2017
Filed:
Aug. 18, 2016
Western Digital (Fremont), Llc, Fremont, CA (US);
Shaoping Li, San Ramon, CA (US);
Gerardo A. Bertero, Redwood City, CA (US);
Ming Mao, Dublin, CA (US);
Shihai He, Fremont, CA (US);
Steven C. Rudy, Carmel Valley, CA (US);
Haiwen Xi, San Jose, CA (US);
Zhipeng Li, Fremont, CA (US);
Haifeng Wang, San Jose, CA (US);
Jianxin Fang, San Jose, CA (US);
Zhihong Zhang, Fremont, CA (US);
Yingbo Zhang, San Ramon, CA (US);
Qunwen Leng, Palo Alto, CA (US);
Christopher L. Beaudry, San Jose, CA (US);
Ruisheng Liu, San Jose, CA (US);
Western Digital (Fremont), LLC, Fremont, CA (US);
Abstract
A magnetic read apparatus has a media-facing surface (MFS) and includes a read sensor, a magnetic bias structure and an insulating layer. The read sensor has a side, a front occupying part of the MFS and a back. The read sensor includes a free layer, a pinned layer and a barrier layer between the free and pinned layers. The barrier layer has a barrier layer coefficient of thermal expansion. The magnetic bias structure is adjacent to the side of the free layer. The insulating layer includes first and second portions. The first portion of the insulating layer is between the read sensor side and the magnetic bias structure. The second portion of the insulating layer adjoins the read sensor back. The insulating layer has an insulating layer coefficient of thermal expansion that is at least ⅓ of and not more than 5/3 of the barrier layer coefficient of thermal expansion.