The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9715399 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 25, 2017

Filed:

Jan. 27, 2010
Applicant:

Lior Yaffe, Hadera, IL;

Inventor:

Lior Yaffe, Hadera, IL;

Assignee:

SOFTWARE AG, Darmstadt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04J 3/24 (2006.01); G06F 9/455 (2006.01); H04L 12/701 (2013.01);
U.S. Cl.
CPC ...
G06F 9/455 (2013.01); H04L 45/00 (2013.01);
Abstract

The present technology concerns a mainframe injection component (MIC) for manipulating at least one data packet communicated between at least one emulator and at least one mainframe. A packet processor is configured to receive the at least one data packet, manipulate the at least one received data packet to produce at least one modified data packet, and inject the at least one modified data packet into the communication between the at least one emulator and the at least one mainframe. The packet processor is further configured to retrieve at least one processing instruction from a repository according to at least one pre-defined processing rule and to apply the at least one processing instruction on the at least one received data packet to produce the at least one modified data packet.


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Yaffe, Lior. (2017). Mainframe injection component and method for manipulating data packets communicated between emulators and mainframes (U.S. Patent No. 9715399). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9715399

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