The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2017

Filed:

Mar. 26, 2015
Applicant:

Sensata Technologies, Inc., Attleboro, MA (US);

Inventors:

Shihong Huo, Bedford, MA (US);

Cory Bousquet, Cranston, RI (US);

Daniel Goncalves, Milford, MA (US);

Assignee:

Sensata Technologies, Inc., Attleboro, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); G01L 1/18 (2006.01); G01R 17/00 (2006.01); G01L 19/00 (2006.01);
U.S. Cl.
CPC ...
G01L 1/18 (2013.01); G01L 9/0042 (2013.01); G01L 9/0054 (2013.01); G01L 19/0084 (2013.01); G01R 17/00 (2013.01);
Abstract

Methods and apparatus for a semiconductor strain gauge pressure sensor. An apparatus includes a sense element configured to be exposed to a pressure environment, the sense element including at least one highly doped semiconductor strain gauge, the highly doped semiconductor strain gauge including a five pad single full Wheatstone bridge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that comprises the sense element, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.


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