The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2017

Filed:

Nov. 05, 2012
Applicant:

Shimadzu Corporation, Kyoto, JP;

Inventors:

Isao Katasho, Kyoto, JP;

Tetsuo Ohashi, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C12M 1/00 (2006.01); C12Q 1/68 (2006.01); H02K 44/00 (2006.01); H02K 44/08 (2006.01); H02K 44/02 (2006.01); G01N 33/04 (2006.01); G01N 33/487 (2006.01); B01L 3/00 (2006.01); B01L 7/00 (2006.01); G01N 35/00 (2006.01);
U.S. Cl.
CPC ...
C12Q 1/6806 (2013.01); B01L 3/502761 (2013.01); G01N 33/04 (2013.01); G01N 33/48707 (2013.01); H02K 44/02 (2013.01); B01L 3/502707 (2013.01); B01L 7/52 (2013.01); B01L 2200/0668 (2013.01); B01L 2200/0673 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0864 (2013.01); B01L 2300/0867 (2013.01); B01L 2300/165 (2013.01); B01L 2400/043 (2013.01); G01N 35/0098 (2013.01); Y10T 29/49 (2015.01);
Abstract

A chip device for manipulating an object component is described, in which multiple liquid substances such as reagents required for a series of manipulations on a sample are stably secured in separated states throughout the manipulations within the device. The chip device includes a manipulation chip, magnetic particles, and a magnetic field application means. The manipulation chip includes a substrate, a groove formed in the surface of the substrate, and a manipulation medium accommodated in the groove such that gel phases and aqueous liquid phases are alternately disposed in the longitudinal direction of the groove and are in contact with each other. The magnetic particles are for capturing and carrying the object component. The magnetic field application means is capable of moving the magnetic particles in the longitudinal direction of the groove in the substrate by the application of a magnetic field to the substrate.


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