The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2017

Filed:

Sep. 26, 2013
Applicant:

U.s. Army Research Laboratory Attn: Rdrl-loc-i, Adelphi, MD (US);

Inventors:

Randy A. Mrozek, Port Deposit, MD (US);

Joseph L. Lenhart, Port Deposit, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/24 (2006.01); H01B 1/02 (2006.01); C01B 31/04 (2006.01); H01M 4/60 (2006.01); C09K 5/14 (2006.01); H01B 1/20 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); H01B 1/20 (2013.01); H01B 1/22 (2013.01); H01B 1/24 (2013.01);
Abstract

Electrically and/or thermally conductive polymer composites and methods of preparing same are provided. In some embodiments, a method for preparing an electrically and/or thermally conductive polymer composite may include (1) mixing a polymer, a conductive particulate filler, and a solvent to form a non-conductive polymer solution or melt; (2) processing, the non-conductive polymer solution or melt to form a non-conductive polymer network composition; wherein the presence of solvent during three-dimensional network formation manipulates the polymer network structure; and (3) removing the solvent from the non-conductive polymer network composition to form an electrically and/or thermally conductive polymer composite. The altered polymer chain structure present in the non-conductive polymer network composition is maintained in the composite, and offsets the impact of particulate filler addition including increased modulus, decreased elasticity, and decreased elongation at break. This method enables development of composite materials with electrical/thermal and mechanical performance that can be tailored independently.


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