The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2017
Filed:
Jun. 20, 2014
Applicants:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Inventors:
Leo Li, Shanghai, CN;
Shabbir Attarwala, Simsbury, CT (US);
Assignees:
Henkel IP & Holding GmbH, Duesseldorf, DE;
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C08G 59/56 (2006.01); C08G 59/66 (2006.01); C08G 59/50 (2006.01); C08G 59/40 (2006.01);
U.S. Cl.
CPC ...
C08G 59/50 (2013.01); C08G 59/4064 (2013.01);
Abstract
The present invention relates to a temporarily bonded adhesive composition used in wafer manufacturing, to the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, an amine and a water soluble polymer.
Li, Leo. (2017). Adhesive composition for temporarily bonding use in wafer manufacturing (U.S. Patent No. 9714317). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9714317
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile