The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2017

Filed:

Mar. 30, 2015
Applicant:

Second Sight Medical Products, Inc., San Fernando, CA (US);

Inventors:

Jerry Ok, Canyon Country, CA (US);

Robert J Greenberg, Los Angeles, CA (US);

Neil Hamilton Talbot, La Cresenta, CA (US);

James S Little, Arvada, CO (US);

Rongqing Dai, Valencia, CA (US);

Jordan Matthew Neysmith, Mountain View, CA (US);

Kelly H McClure, Simi Valley, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61N 1/36 (2006.01); A61F 15/00 (2006.01); A61N 1/375 (2006.01); A61N 1/05 (2006.01);
U.S. Cl.
CPC ...
A61N 1/36046 (2013.01); A61F 15/001 (2013.01); A61N 1/0543 (2013.01); A61N 1/36125 (2013.01); A61N 1/375 (2013.01); A61N 1/0529 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/00014 (2013.01);
Abstract

An implantable device, including a first electrically non-conductive substrate; a plurality of electrically conductive vias through the first electrically non-conductive substrate; a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps and electrically connected to at least a subset of the plurality of electrically conductive vias; a flip-chip driver circuit attached to the flip-chip multiplexer circuit using conductive bumps; a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps; discrete passives attached to the second electrically non-conductive substrate; and a cover bonded to the first electrically non-conductive substrate, the cover, the first electrically non-conductive substrate and the electrically conductive vias forming a hermetic package.


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