The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Oct. 17, 2012
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Hidenori Shinohara, Hitachinaka, JP;

Mitsuru Yasunami, Yokohama, JP;

Tadahiko Chida, Tokyo, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01H 9/52 (2006.01); H02M 3/335 (2006.01); H02M 3/28 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H02M 3/28 (2013.01); H02M 3/335 (2013.01); H01H 9/52 (2013.01); H01L 23/473 (2013.01);
Abstract

In a DC-DC converter, the cooling of switching elements has been performed only by means of a cooling plate; therefore, there is a problem in that, to effectively radiate heats generated by power MOSFETs that have large heating values and that are arranged parallel, it becomes necessary to reduce thermal resistances and complicate the cooling route of a water-cooling device. Plural switching elements for controlling currents flowing through inductor elements, which are used for voltage conversion of a DC-DC converter, are fixed to a metal case via a heat conductive insulating material and via a metal radiator having a better heat conduction characteristic than the metal case. Because there occur no large mixing phenomena of heat currents among neighboring switching elements, and there are only little heat interferences between the neighboring switching elements, the thermal diffusion characteristic is improved, and the cooling efficiency for the switching elements can be increased.


Find Patent Forward Citations

Loading…