The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Sep. 05, 2014
Applicant:

Sony Computer Entertainment Inc., Tokyo, JP;

Inventors:

Furubo Takayuki, Chiba, JP;

Shinichi Takeyama, Chiba, JP;

Beppu Hirokuni, Chiba, JP;

Nobuyuki Sugawara, Chiba, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H05K 7/14 (2006.01); G06F 1/16 (2006.01); H01H 13/14 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0217 (2013.01); G06F 1/1658 (2013.01); H05K 7/142 (2013.01); H01H 13/14 (2013.01); H01H 2221/044 (2013.01);
Abstract

Electronic apparatus includes a housing configured to have an inner layer portion forming an inner surface and an outer layer portion forming an outer surface. The inner layer portion and the outer layer portion are formed by two-color molding. The electronic apparatus includes one of a region in which the inner layer portion is not formed and a region in which the inner layer portion is thin. The one region is set in the inner surface of the housing. The electronic apparatus further includes a component configured to be housed in the housing and is disposed in the one region.


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