The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Jan. 09, 2015
Applicant:
Panasonic Corporation, Osaka, JP;
Inventor:
Koichi Hirano, Osaka, JP;
Assignee:
PANASONIC CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/12 (2006.01); B05D 7/00 (2006.01); B05D 1/36 (2006.01); B05D 1/28 (2006.01); B41F 7/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4664 (2013.01); H05K 3/1275 (2013.01); B05D 1/28 (2013.01); B05D 1/36 (2013.01); B05D 5/12 (2013.01); B05D 7/50 (2013.01); B41F 7/02 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/0537 (2013.01); H05K 2203/1461 (2013.01);
Abstract
A manufacturing method for an electronic device according to the present disclosure includes (i) forming an insulating film on a surface of a cylinder, (ii) forming the insulating film having a via hole on the surface of the cylinder by pressing a relief member against the insulating film to remove a portion of the insulating film facing a protrusion of the relief member, and (iii) providing a precursor of an insulating layer having the via hole filled with conductive ink on a wiring substrate, wherein the via hole faces a wiring of the wiring substrate.