The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Dec. 12, 2013
Applicants:

Hefei Boe Optoelectronics Technology Co., Ltd., Hefei, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Liang Cheng, Beijing, CN;

Yang Li, Beijing, CN;

Peng Qi, Beijing, CN;

Yang Huang, Beijing, CN;

Xiaowei Gong, Beijing, CN;

Lian Sun, Beijing, CN;

Chunyang Nie, Beijing, CN;

Min Wang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/0296 (2013.01); H05K 1/117 (2013.01); H05K 3/323 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/10136 (2013.01);
Abstract

A Chip on Film (COF) flexible circuit board and a display device using the COF flexible circuit board are provided. The circuit board includes: a substrate; a plurality of conductive terminals arranged separately in parallel over the substrate, each of the plurality of conductive terminals including a wide line and a narrow line; and a anisotropic conductive adhesive region provided over the substrate. A connection site of the wide line and the narrow line is located in an overlapping area of the anisotropic conductive adhesive region and the substrate. The embodiments of the invention can reduce the probability of the circuit board being broken and the undesirable phenomena such as open circuit.


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