Detecting transient signals using stacked-chip imaging systems

Abstract

Imaging systems may be provided with stacked-chip image sensors. A stacked-chip image sensor may include a vertical chip stack that includes an array of image pixels, control circuitry and storage and processing circuitry. The image pixel array may be coupled to the control circuitry using vertical metal interconnects. The control circuitry may provide digital image data to the storage and processing circuitry over additional vertical conductive. The stacked-chip image sensor may be configured to capture image frames at a capture frame rate and to output processed image frames at an output frame rate that is lower that the capture frame rate. The storage and processing circuitry may be configured to process image frames concurrently with image capture operations. Processing image frames concurrently with image capture operations may include adjusting the positions of moving objects and by adjusting the pixel brightness values of regions of image frames that have changing brightness.