The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Aug. 01, 2014
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventor:
Masaaki Kanae, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01); H01L 41/053 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0533 (2013.01); H03H 9/1071 (2013.01); H03H 9/1085 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/48091 (2013.01);
Abstract
Provide an electronic component that has a hollowed structure and is capable of suppressing the deformation of the hollowed structure due to the pressure during the module resin molding. The electronic component includes a device substrate, a driver portionformed on one of the principle surfaces of the device substrate, a protection portionconfigured to cover the driver portionso as to form a hollowed spacearound the driver portion, an adhesion layerthat is made of a resin and arranged above the protection portion, and a reinforcing platearranged on the adhesion layer, wherein the reinforcing plateis a silicon substrate.