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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9711707 B1

PDFFull Text
Date of Patent:
Jul. 18, 2017

Filed:

Jan. 22, 2014

Method for manufacturing an electronic device

Applicant:

Seiko Instruments Inc., Chiba-shi, Chiba, JP;

Inventor:

Atsushi Kozuki, Chiba, JP;

Assignee:

SEIKO INSTRUMENTS INC., Chiba, JP;

Attorney:

Brinks Gilson & Lione

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H01L 41/053 (2006.01); H03H 9/10 (2006.01); H03H 3/007 (2006.01); H01L 41/23 (2013.01); H01L 41/293 (2013.01); H01L 41/29 (2013.01); H01L 41/047 (2006.01); H01L 41/297 (2013.01); H03H 3/02 (2006.01); H01L 23/48 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0533 (2013.01); H01L 41/0477 (2013.01); H01L 41/053 (2013.01); H01L 41/23 (2013.01); H01L 41/29 (2013.01); H01L 41/293 (2013.01); H01L 41/297 (2013.01); H03H 9/105 (2013.01); H03H 9/1014 (2013.01); H03H 9/1021 (2013.01); H03H 9/1057 (2013.01); H03H 9/1071 (2013.01); H03H 9/1092 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01); H03H 3/007 (2013.01); H03H 9/10 (2013.01); H03H 2003/022 (2013.01); Y10T 29/42 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49155 (2015.01);
Abstract

A method for manufacturing an electronic device includes a through electrode forming step of forming a through electrode on an insulating base substrate; an electronic element mounting step of mounting an electronic element on one surface of the base substrate; a cover body placing step of bonding a cover body accommodating the electronic element; a conductive film forming step of forming a conductive film on the other surface of the base substrate and on an end face of the through electrode exposing on the other surface; an electrode pattern forming step of forming an electrode pattern on the end face of the through electrode and on the surface of the periphery of the end face while leaving the conductive film; and an external electrode forming step of forming an external electrode by accumulating an electroless plated film on the surface of the electrode pattern by an electroless plating method.

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