The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Feb. 12, 2008
Applicants:
Jian-hui Xie, Guangdong, CN;
Chi Wing Leung, Hong Kong, CN;
Xuan Wang, Guangdong, CN;
Inventors:
Assignee:
CREE HUIZHOU OPTO LIMITED, Huizhou Municipality, Guangdong Province, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); F21V 29/70 (2015.01); H01L 23/057 (2006.01); H05K 7/20 (2006.01); F21V 29/507 (2015.01); F21V 29/503 (2015.01);
U.S. Cl.
CPC ...
H01L 33/644 (2013.01); F21V 29/70 (2015.01); H01L 23/057 (2013.01); F21V 29/503 (2015.01); F21V 29/507 (2015.01); H01L 33/642 (2013.01); H01L 2224/32245 (2013.01); H05K 7/2039 (2013.01);
Abstract
The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one side surface. A recess is formed in the first surface and extends into the casing. plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation.