The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Jun. 04, 2015
Applicants:

Chung Hoon Lee, Ansan-si, KR;

Dae Sung Kal, Ansan-si, KR;

Ki Bum Nam, Ansan-si, KR;

Inventors:

Chung Hoon Lee, Ansan-si, KR;

Dae Sung Kal, Ansan-si, KR;

Ki Bum Nam, Ansan-si, KR;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 33/36 (2010.01); H01L 33/44 (2010.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/507 (2013.01); H01L 23/49805 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 33/005 (2013.01); H01L 33/0095 (2013.01); H01L 33/36 (2013.01); H01L 33/44 (2013.01); H01L 33/50 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/33 (2013.01); H01L 33/0079 (2013.01); H01L 33/486 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/06151 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/16013 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16151 (2013.01); H01L 2224/27462 (2013.01); H01L 2224/325 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/33151 (2013.01); H01L 2224/81893 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83893 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15787 (2013.01); H01L 2933/0033 (2013.01);
Abstract

A semiconductor device including a first lead electrode and a second lead electrode; a semiconductor stack structure disposed on the member, the semiconductor stack structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active region interposed between the first and second conductive semiconductor layers; a first electrode electrically connected to the first conductive semiconductor layer; a second electrode electrically connected to the second conductive semiconductor layer; a plating layer configured to bond the semiconductor stack structure to the member; and a first wavelength converter that covers at least side surfaces of the semiconductor stack structure.


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