Thin film transistor and manufacturing method thereof

Abstract

The manufacturing method of the thin film transistor includes the following steps. A gate, a first insulating layer, a second insulating layer, a metal oxide semiconductor layer, a first etching stop layer, a second etching stop layer and a photoresist structure are sequentially formed. The second etching stop layer, the first etching stop layer, and the metal oxide semiconductor layer are patterned using the photoresist structure as a mask to form a pre-second etching stop pattern, a pre-first etching stop pattern, and a metal oxide semiconductor pattern. The pre-second etching stop pattern and the pre-first etching stop pattern are patterned using the remaining thick portion of the photoresist structure as a mask to form a second etching stop pattern and a first etching stop pattern, and a portion of the second insulating layer is removed to form an insulating pattern. A source and a drain are formed.