The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Sep. 09, 2013
Applicant:

Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Kazuhiro Mochizuki, Tokyo, JP;

Norifumi Kameshiro, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 29/861 (2006.01); H01L 29/872 (2006.01); H01L 29/06 (2006.01); B60L 11/18 (2006.01); H02M 7/537 (2006.01); H02P 27/06 (2006.01); H01L 29/36 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); B60L 11/1803 (2013.01); H01L 29/0615 (2013.01); H01L 29/0619 (2013.01); H01L 29/36 (2013.01); H01L 29/6606 (2013.01); H01L 29/8611 (2013.01); H01L 29/872 (2013.01); H02M 7/537 (2013.01); H02P 27/06 (2013.01);
Abstract

In a semiconductor device having a silicon carbide device, a technique capable of suppressing variation in a breakdown voltage and achieving reduction in an area of a termination structure is provided. In order to solve the above-described problem, in the present invention, in a semiconductor device having a silicon carbide device, a p-type first region and a p-type second region provided to be closer to an outer peripheral side than the first region are provided in a junction termination portion, a first concentration gradient is provided in the first region, and a second concentration gradient larger than the first concentration gradient is provided in the second region.


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