The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9711509 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 18, 2017

Filed:

Apr. 23, 2015
Applicant:

Renesas Electronics Corporation, Kanagawa, JP;

Inventor:

Hiroyuki Hoshizaki, Hitachinaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10808 (2013.01); H01L 27/10852 (2013.01); H01L 28/90 (2013.01);
Abstract

To effectively prevent short circuit between capacitors adjacent to each other. A semiconductor device has a substrate, an interlayer insulating film, a plurality of capacitors, and an isolation insulating film. The interlayer insulating film is located over the substrate. The capacitors are located in a plurality of recesses, respectively. The recesses each have an opening in the surface of the interlayer insulating film. The isolation insulating film lies in the interlayer insulating film. The isolation insulating films are located between recesses adjacent to each other in plan view. Further, the isolation insulating film is made of a material different from that of the interlayer insulating film.


Find Patent Forward Citations

Hoshizaki, Hiroyuki. (2017). Semiconductor device (U.S. Patent No. 9711509). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9711509

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