The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Apr. 19, 2016
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Takeshi Hosomi, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/544 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 23/3114 (2013.01); H01L 23/66 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device includes: a semiconductor chip including an electronic part; and a package sealing the semiconductor chip, wherein the package includes a transparent section which is opaque to visible light and transparent to near-infrared light or near-ultraviolet light, and the transparent section is disposed in such a way that the electronic part is observed from outside under the near-infrared light or the near-ultraviolet light.