The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Nov. 29, 2016
Applicant:
Ajinomoto Co., Inc., Tokyo, JP;
Inventors:
Assignee:
Ajinomoto Co., Inc., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); C08K 7/18 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49894 (2013.01); C08K 3/36 (2013.01); C08K 7/18 (2013.01); H01L 21/481 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); C08K 2201/003 (2013.01); C08K 2201/006 (2013.01);
Abstract
Resin compositions containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler in which the content of (C) the inorganic filler is 55% by mass or higher with respect to 100% by mass of a non-volatile component within the resin composition, the average particle diameter of (C) the inorganic filler is 0.05 to 0.35 μm, the product of the specific surface area (m/g) of (C) the inorganic filler and the true density of (C) the inorganic filler is 1 to 77 m/g and the moisture permeation of a cured product obtained by thermally cured the resin composition is 0.05 to 2.8 g·mm/m·24 h are useful for making printed wiring boards.