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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9711433 B1

PDFFull Text
Expired
Date of Patent:
Jul. 18, 2017

Filed:

Nov. 03, 2015

Semiconductor device, method of manufacturing the same, and electronic device

Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Jun Taniguchi, Isehara, JP;

Takeshi Shioga, Atsugi, JP;

Yoshihiro Mizuno, Kobe, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:

Fujitsu Patent Center

Primary Examiner:

Jarrett Stark

Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 21/322 (2006.01); H01L 21/54 (2006.01); H01L 23/427 (2006.01); H01L 23/522 (2006.01); H01L 23/40 (2006.01); H01L 23/10 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/3081 (2013.01); H01L 21/30625 (2013.01); H01L 21/3223 (2013.01); H01L 21/4882 (2013.01); H01L 21/54 (2013.01); H01L 23/3677 (2013.01); H01L 23/427 (2013.01); H01L 23/5226 (2013.01); H01L 25/0657 (2013.01); H01L 23/10 (2013.01); H01L 23/16 (2013.01); H01L 23/4006 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A semiconductor device includes: a first semiconductor element; a first substrate provided on the first semiconductor element and including a cavity with reduced pressure; coolant held inside the cavity; a second semiconductor element provided on the first substrate; and a heat spreading member thermally connected to the first substrate and provided with a hole communicated with the cavity.

Find Patent Forward Citations

Taniguchi, Jun. (2017). Semiconductor device, method of manufacturing the same, and electronic device (U.S. Patent No. 9711433). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9711433

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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