The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Nov. 03, 2015
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 21/322 (2006.01); H01L 21/54 (2006.01); H01L 23/427 (2006.01); H01L 23/522 (2006.01); H01L 23/40 (2006.01); H01L 23/10 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/3081 (2013.01); H01L 21/30625 (2013.01); H01L 21/3223 (2013.01); H01L 21/4882 (2013.01); H01L 21/54 (2013.01); H01L 23/3677 (2013.01); H01L 23/427 (2013.01); H01L 23/5226 (2013.01); H01L 25/0657 (2013.01); H01L 23/10 (2013.01); H01L 23/16 (2013.01); H01L 23/4006 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor device includes: a first semiconductor element; a first substrate provided on the first semiconductor element and including a cavity with reduced pressure; coolant held inside the cavity; a second semiconductor element provided on the first substrate; and a heat spreading member thermally connected to the first substrate and provided with a hole communicated with the cavity.