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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9711432 B1

PDFFull Text
Date of Patent:
Jul. 18, 2017

Filed:

Jan. 07, 2015

Electronic power device with improved cooling

Applicant:

Safran Electronics & Defense, Boulogne Billancourt, FR;

Inventor:

Jean-Christophe Riou, Boulogne Billancourt, FR;

Assignee:

SAFRAN ELECTRONICS & DEFENSE, Boulogne Billancourt, FR;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Reema Patel

Assistant Examiner:

Syed Gheyas

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/44 (2006.01); H05K 7/20 (2006.01); H01L 23/00 (2006.01); B81B 7/00 (2006.01); H01L 23/06 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/44 (2013.01); B81B 7/0093 (2013.01); H01L 23/06 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/074 (2013.01); H05K 7/20236 (2013.01); H05K 7/20927 (2013.01); B81B 2201/01 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19107 (2013.01);
Abstract

An electronic device comprising at least one electronic component mounted on a support and surrounded by a deformable casing containing a heat-conducting and electrically-insulating liquid, the device comprising a heat dissipation plate that is substantially parallel to the support and spaced apart therefrom, and heat exchange means for heat exchange by conduction between the casing and the plate, the heat-conducting and electrically-insulating liquid being selected and the casing being arranged so that thermal expansion of the oil leads to the casing applying force against the means for heat exchange by conduction.

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