The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Sep. 11, 2014
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Inventors:
Yuhei Nishida, Matsumoto, JP;
Tatsuo Nishizawa, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/049 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 21/4882 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/049 (2013.01); H01L 23/49811 (2013.01); H01L 24/45 (2013.01); H01L 25/072 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor device is fastened to a heat dissipation member such that a force directed downward acts from a metal substrate onto the heat dissipation member, with a rim portion of a storage region as a fulcrum with respect to the heat dissipation member. As a result, a heat conductive material can be spread into a thinner layer between the metal substrate and the heat dissipation member, improving the heat dissipation between the metal substrate and the heat dissipation member.