The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Mar. 21, 2016
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Hans Weber, Bayerisch Gmain, DE;

Andreas Moser, Maria-Rain, AT;

Johannes Baumgartl, Riegersdorf, AT;

Gabor Mezoesi, Villach, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/324 (2006.01); H01L 29/06 (2006.01); H01L 21/265 (2006.01); H01L 21/225 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01); H01L 29/04 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/033 (2013.01); H01L 21/2254 (2013.01); H01L 21/26513 (2013.01); H01L 21/324 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 29/045 (2013.01); H01L 29/0634 (2013.01); H01L 29/66795 (2013.01);
Abstract

A semiconductor device is manufactured in a semiconductor body by forming an initial mask on a process surface of a semiconductor layer, openings in the mask exposing a part of the semiconductor layer in alignment structure and super-junction structure areas. A recess structure is formed in the semiconductor layer at portions of the process surface that are exposed by the openings, the recess structure in the alignment structure area constituting an initial alignment structure. Dopants are introduced into the semiconductor layer through portions of the process surface that are exposed by the openings of the initial mask. The dopants introduced in the super-junction area constitute part of a super-junction structure. A thickness of the semiconductor layer is increased by growing an epitaxial layer. The initial alignment structure is imaged into the process surface. Dopants are introduced into the semiconductor layer by using a mask aligned to the initial alignment structure.


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