The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Sep. 05, 2014
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Shiro Tsukamoto, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); B21K 23/04 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3417 (2013.01); C23C 14/3407 (2013.01); C23C 14/3414 (2013.01); H01J 37/3423 (2013.01); H01J 37/3426 (2013.01); H01J 37/3435 (2013.01); H01J 37/3491 (2013.01); B21K 23/04 (2013.01);
Abstract

Provided is a backing plate-integrated metal sputtering target comprising a flange part that is formed integrally with a target of which periphery becomes a backing plate, wherein the flange part comprises a structure obtained by repeating partial forging. By increasing the mechanical strength of only the flange part of the target in a backing plate-integrated sputtering target as described above, it is possible to inhibit the deformation of the target during sputtering and a change in the conventional sputtering properties; thereby the formation of thin films having superior uniformity can be realized, and the yield and reliability of semiconductor products, which are being subject to further miniaturization and higher integration, can be improved.


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