The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Oct. 07, 2016
Applicant:
Chang Chun Petrochemical Co., Ltd., Taipei, TW;
Inventor:
Kuei-Sen Cheng, Taipei, TW;
Assignee:
Chang Chun Petrochemical Co., Ltd., Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21C 37/00 (2006.01); F28F 13/18 (2006.01); C25D 3/38 (2006.01); C25D 1/04 (2006.01); C23C 28/00 (2006.01); C23C 24/08 (2006.01); H05K 7/20 (2006.01); F28F 21/08 (2006.01); F28F 21/02 (2006.01);
U.S. Cl.
CPC ...
F28F 13/18 (2013.01); C23C 24/082 (2013.01); C23C 28/32 (2013.01); C23C 28/34 (2013.01); C25D 1/04 (2013.01); C25D 3/38 (2013.01); F28F 21/02 (2013.01); F28F 21/085 (2013.01); H05K 7/2039 (2013.01); F28F 2255/02 (2013.01); F28F 2275/025 (2013.01);
Abstract
A method of producing a composite heat dissipating structure by depositing a slurry of graphene particles upon a copper foil, drying the slurry to form a layer of graphene in contact with the copper foil, and consolidating the layer of graphene under pressure to reduce the thickness of the graphene layer and recovering the composite heat dissipating structure. Heat dissipating copper foils and composite heat dissipating structures and electronic devices incorporating the same are also disclosed herein.