The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Feb. 20, 2013
Applicant:

Dai-ichi Kogyo Seiyaku Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Satoshi Murakami, Kyoto, JP;

Manabu Kikuta, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 25/14 (2006.01); H05K 1/00 (2006.01); H05K 3/00 (2006.01); C08K 5/3475 (2006.01); C08L 101/00 (2006.01); C08K 5/00 (2006.01); C08K 5/11 (2006.01); C08K 5/12 (2006.01); C08K 5/523 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08K 5/3475 (2013.01); C08K 5/005 (2013.01); C08K 5/11 (2013.01); C08K 5/12 (2013.01); C08K 5/523 (2013.01); C08L 101/00 (2013.01); H05K 1/03 (2013.01); H05K 3/0011 (2013.01);
Abstract

A resin composition for laser processing which is able to enhance laser processability with maintaining a resist performance of a resin after ultraviolet laser processing, and which can be, for example, used as a resist in forming a circuit of a printed wiring board is provided. Disclosed is a resin composition for laser processing containing a resin and an ultraviolet absorber, wherein the resin is a thermoplastic resin having a carboxyl group and having a softening temperature of from 70 to 140° C., and a content of the ultraviolet absorber is from 1 to 30 parts by mass based on 100 parts by mass of the thermoplastic resin.


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