The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Jan. 29, 2014
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Sterling Chaffins, Albany, OR (US);
Kevin P. DeKam, Albany, OR (US);
Chien-Hua Chen, Corvallis, OR (US);
Assignee:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/175 (2006.01); B29B 11/06 (2006.01); B41J 2/015 (2006.01); B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/175 (2013.01); B29B 11/06 (2013.01); B41J 2/1603 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1632 (2013.01); B41J 2/1637 (2013.01); B41J 2002/14362 (2013.01); H01L 2924/181 (2013.01); H01L 2924/186 (2013.01);
Abstract
A fluid directing assembly can comprise a molded support comprising a modified epoxy molded compound which includes epoxy resin, cross-linker, filler, and is devoid of wax release agent. The assembly can also include a silicon die attached to the molded support and wherein the silicon die and the molded support define a fluid directing channel.