The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Feb. 20, 2015
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Chun-Wei Su, New Taipei, TW;

Chyi-Ming Leu, Jhudong Township, TW;

Yu-Ju Kuo, New Taipei, TW;

Hong-Ching Lin, Kaohsiung, TW;

Chun-An Lu, New Taipei, TW;

Chiung-Hsiung Chen, Zhudong Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 39/02 (2006.01); H05K 3/20 (2006.01); B29C 39/00 (2006.01); B29C 35/02 (2006.01); B29L 31/34 (2006.01); B29K 27/00 (2006.01); B29K 79/00 (2006.01); B29K 505/00 (2006.01);
U.S. Cl.
CPC ...
B29C 39/02 (2013.01); B29C 39/003 (2013.01); H05K 3/207 (2013.01); B29C 35/02 (2013.01); B29K 2027/16 (2013.01); B29K 2079/08 (2013.01); B29K 2505/00 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3425 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/1131 (2013.01);
Abstract

A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern' where the only change is the addition of wires.


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