The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Jan. 30, 2012
Kuniyasu Shiro, Kyoto, JP;
Masaharu Wada, Kyoto, JP;
Hiroyasu Kato, Kyoto, JP;
Hajime Nishimura, Otsu, JP;
Satoshi Yanagisawa, Anpachi-gun, JP;
Yukihiro Matsuzaki, Anpachi-gun, JP;
Kuniyasu Shiro, Kyoto, JP;
Masaharu Wada, Kyoto, JP;
Hiroyasu Kato, Kyoto, JP;
Hajime Nishimura, Otsu, JP;
Satoshi Yanagisawa, Anpachi-gun, JP;
Yukihiro Matsuzaki, Anpachi-gun, JP;
Toray Industries, Inc., Tokyo, JP;
Toray Coatex Co., Ltd., Kyoto, JP;
Abstract
A polishing pad is provided with a compression elastic modulus of 0.17 MPa or more and 0.32 MPa or less produced by preparing a nonwoven fabric formed of bundles of ultrafine fibers with an average monofilament diameter of 3.0 μm or more and 8.0 μm or less, preparing a polishing pad base by impregnating the nonwoven fabric with a polyurethane based elastomer in an amount of 20 mass % or more and 50 mass % or less relative to the mass of the polishing pad base, and laminating the polishing pad base with a porous polyurethane layer containing wet-solidified polyurethane as primary component which has openings with an average opening diameter of 10 μm or more and 90 μm or less in its surface to serve as polishing surface layer.