The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Dec. 23, 2011
Applicants:
Sung Wuk Ryu, Seoul, KR;
Seong BO Shim, Seoul, KR;
Seung Yul Shin, Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H05K 3/40 (2006.01); H05K 13/00 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H05K 3/4007 (2013.01); H05K 13/00 (2013.01); H05K 3/28 (2013.01); H05K 3/3473 (2013.01); H05K 2201/0367 (2013.01); H05K 2203/054 (2013.01); H05K 2203/0577 (2013.01);
Abstract
A printed circuit board according the present embodiment includes an insulating layer; at least one circuit pattern or pad formed on the insulating layer; a solder resist having an opening section exposing the upper surface of the pad and formed on the insulating layer and a bump formed on the pad exposed through the opening section of the solder resist and having a lower area narrower than the upper area.