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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9706651 B1

PDFFull Text
Date of Patent:
Jul. 11, 2017

Filed:

Nov. 30, 2012

Resin composition, prepreg, and laminate

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Chisato Saito, Tokyo, JP;

Masanobu Sogame, Tokyo, JP;

Yoshinori Mabuchi, Tokyo, JP;

Yoshihiro Kato, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Tae H Yoon

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/05 (2006.01); B32B 15/092 (2006.01); C08L 61/14 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08G 59/40 (2006.01); B32B 15/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B32B 15/14 (2013.01); C08G 59/4007 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); H05K 1/056 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2305/076 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/24917 (2015.01); Y10T 428/31515 (2015.04); Y10T 428/31522 (2015.04);
Abstract

To provide a prepreg resin composition which has good solubility in a solvent and with which moreover a cured product having excellent flame resistance and a low water absorption rate can be made simply and with good reproducibility, and a prepreg and a laminate and a printed wiring board and the like using the same. The prepreg resin composition of the present invention including at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler.

Find Patent Forward Citations

Saito, Chisato. (2017). Resin composition, prepreg, and laminate (U.S. Patent No. 9706651). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9706651

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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