The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Jan. 15, 2016
Applicant:

Astec International Limited, Kowloon, HK;

Inventors:

Daryl Weispfennig, Chanhassen, MN (US);

Bradley Schumacher, Savage, MN (US);

Kwong Kei Chin, Fremont, CA (US);

Assignee:

ASTEC INTERNATIONAL LIMITED, Kwun Tong, Kowloon, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 23/49582 (2013.01); H05K 1/0298 (2013.01); H05K 1/0313 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01);
Abstract

An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.


Find Patent Forward Citations

Loading…