The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Aug. 22, 2013
Applicant:

Harman Becker Automotive Systems Gmbh, Karlsbad, DE;

Inventors:

Guenther Kraft, Karlsruhe, DE;

Stephan Joos, Karlsbad, DE;

Krunoslav Orcic, Karlsbad, DE;

Walter Knappich, Karlsbad, DE;

Didier Berthomier, Karlsbad, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H05K 1/02 (2006.01); H01L 23/42 (2006.01); H01L 21/48 (2006.01); H01L 23/552 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01L 21/4853 (2013.01); H01L 23/42 (2013.01); H01L 23/552 (2013.01); H05K 1/0204 (2013.01); H05K 1/024 (2013.01); H05K 3/3484 (2013.01); H05K 13/0465 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/19105 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/1572 (2013.01);
Abstract

Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.


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