logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9705202 B1

PDFFull Text
Date of Patent:
Jul. 11, 2017

Filed:

Jan. 30, 2015

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Hirofumi Kawamura, Chiba, JP;

Yasuhiro Okada, Tokyo, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:

Dentons US LLP

Primary Examiner:

Tuan A Tran

Int. Cl.
CPC ...
H04B 1/38 (2015.01); H01Q 21/00 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01P 3/12 (2006.01); H01Q 9/04 (2006.01); H01Q 23/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/00 (2013.01); H01L 23/48 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01P 3/121 (2013.01); H01P 3/122 (2013.01); H01Q 9/0407 (2013.01); H01Q 23/00 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/1005 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1903 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30111 (2013.01);
Abstract

A millimeter-wave dielectric transmission device. The millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.

Find Patent Forward Citations

Loading…