The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Apr. 01, 2013
Applicants:

Pioneer Corporation, Kawasaki-shi, Kanagawa, JP;

Tohoku Pioneer Corporation, Tendo-shi, Yamagata, JP;

Inventor:

Hidetaka Ohazama, Yonezawa, JP;

Assignees:

PIONEER CORPORATION, Kawasaki-Shi, Kanagawa, JP;

TOHOKU PIONEER CORPORATION, Tendo-Shi, Yamagata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 51/52 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5203 (2013.01); H01L 27/3288 (2013.01); H01L 51/5253 (2013.01); H01L 2251/5369 (2013.01);
Abstract

An electrical component () and a substrate () constitute at least a portion of an electrical device. At least one surface of the substrate () is formed of an insulator. A conductor () is formed on the one surface. The conductor () is covered with a sealing film (). The sealing film () is a film having insulation properties. An opening () is formed in the sealing film (). The opening () is located on a portion of the conductor () when seen in a plan view. The conductor () is connected to the electrical component () with an anisotropic conductive film () interposed therebetween. The anisotropic conductive film () overlaps the opening (), and contains a plurality of metal particles.


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