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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9705052 B1

PDFFull Text
Date of Patent:
Jul. 11, 2017

Filed:

Oct. 28, 2016

Led package structure

Applicants:

Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, Jiangsu, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Yu-Chou Lin, New Taipei, TW;

Chen-Hsiu Lin, New Taipei, TW;

Chih-Yuan Chen, New Taipei, TW;

Assignees:

LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., Changzhou, Jiangsu, CN;

LITE-ON TECHNOLOGY CORPORATION, Taipei, TW;

Attorney:

Li & Cai Intellectual Property (USA) Office

Primary Examiner:

Roy Potter

Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 29/866 (2006.01); H01L 25/16 (2006.01); H01L 33/58 (2010.01); H01L 33/64 (2010.01); H01L 49/02 (2006.01); H01L 25/075 (2006.01); H01L 27/02 (2006.01); G02B 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); G02B 5/0278 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 27/0248 (2013.01); H01L 28/20 (2013.01); H01L 29/866 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

An LED package structure includes a substrate, a circuit layer and an insulating layer both disposed on the substrate, a light-emitting unit, and a reflective housing integrally formed with the insulating layer. The light-emitting unit includes an LED chip and a fluorescent body encapsulating the LED chip. The light-emitting unit is mounted on the insulating layer and the circuit layer. The fluorescent body of the light emitting unit is spaced apart from the circuit layer with a gap in a range of 3˜10 μm. The reflective housing is formed on the insulating layer and the circuit layer and is further filled within the gap. A top plane of the reflective housing arranged away from the substrate is lower than or equal to that of the light-emitting unit, and a distance between the two top planes is in a range of 0˜30 μm.

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