The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Oct. 08, 2013
Applicant:

Showa Denko K.k., Tokyo, JP;

Inventors:

Atsushi Matsumura, Chichibu, JP;

Yu Tokunaga, Chichibu, JP;

Assignee:

SHOWA DENKO K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/40 (2010.01); H01L 33/38 (2010.01); H01L 33/30 (2010.01); H01L 33/44 (2010.01); H01L 33/10 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/387 (2013.01); H01L 33/10 (2013.01); H01L 33/30 (2013.01); H01L 33/44 (2013.01); H01L 33/0079 (2013.01); H01L 33/405 (2013.01);
Abstract

In a light-emitting diode, a plurality of dot-shaped ohmic contact electrodes are provided between a metal reflective film and a compound semiconductor layer, an ohmic electrode and a surface electrode composed of a pad portion and a plurality of linear portions connected to the pad portion are provided in that order on the opposite side of the compound semiconductor layer from the semiconductor substrate, the surface of the ohmic electrode is covered with the linear portions, the ohmic contact electrodes and the ohmic electrode are formed in positions that do not overlap with the pad portion in plan view, and among the plurality of ohmic contact electrodes, 5% or more and 40% or less of the ohmic contact electrodes are disposed in positions that overlap with the linear portions in plan view.


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