The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Jul. 29, 2015
Applicant:
Mc10, Inc., Lexington, MA (US);
Inventors:
Bassel de Graff, San Juan, TT;
Gilman Callsen, Charlottesville, VA (US);
William J. Arora, Bellevue, WA (US);
Roozbeh Ghaffari, Cambridge, MA (US);
Assignee:
MC10, Inc., Lexington, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); A61B 1/04 (2006.01); A61B 5/01 (2006.01); A61B 5/145 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); A61B 1/04 (2013.01); H01L 27/14621 (2013.01); H01L 27/14683 (2013.01); H01L 27/14687 (2013.01); A61B 5/01 (2013.01); A61B 5/145 (2013.01); A61B 2562/02 (2013.01); A61B 2562/0204 (2013.01); A61B 2562/0209 (2013.01); A61B 2562/0233 (2013.01); A61B 2562/0247 (2013.01); A61B 2562/046 (2013.01); A61B 2562/164 (2013.01); H01L 27/14609 (2013.01); H01L 2224/18 (2013.01);
Abstract
System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.