The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Sep. 14, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Thomas Kilger, Regenstauf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01F 27/29 (2006.01); H01L 21/3205 (2006.01); H01L 25/065 (2006.01); H01F 27/28 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01L 21/32051 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/49822 (2013.01); H01L 23/5389 (2013.01); H01L 23/645 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/09 (2013.01); H01L 24/20 (2013.01); H01L 24/94 (2013.01); H01L 24/96 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01F 2027/2809 (2013.01); H01L 21/563 (2013.01); H01L 23/49838 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/19 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0237 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/0381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/11005 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11312 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/484 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/96 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); Y10T 29/4913 (2015.01);
Abstract
A system and method of manufacturing a system are disclosed. An embodiment of the system includes a first packaged component comprising a first component and a first redistribution layer (RDL) disposed on a first main surface of the first packaged component, wherein the first RDL includes first pads. The system further includes a second packaged component having a second component disposed at a first main surface of the second packaged component, the first main surface having second pads and a connection layer between the first packaged component and the second packaged component, wherein the connection layer connects a first plurality of the first pads with the second pads.