The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Apr. 15, 2014
Applicant:
Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;
Inventors:
Masahiro Konishi, Osaka, JP;
Masayuki Itoh, Osaka, JP;
Hiroshi Umeda, Osaka, JP;
Kazuo Tamaki, Osaka, JP;
Masanobu Okano, Osaka, JP;
Assignee:
Sharp Kabushiki Kaisha, Sakai, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 23/00 (2006.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 24/97 (2013.01); H01L 33/0095 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/54 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01);
Abstract
A method for manufacturing a light-emitting device of the present invention includes a step in which solid-state sealing resin () containing a phosphor () and the solid-state sealing resin () containing a phosphor () are arranged in recesses in package resin () having LED chips placed thereon, are thereafter melted by heating, and, in addition, are cured by heating.