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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9704828 B1

PDFFull Text
Date of Patent:
Jul. 11, 2017

Filed:

Oct. 16, 2014

Semiconductor module

Applicant:

Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Kosuke Ikeda, Hanno, JP;

Yuji Morinaga, Hanno, JP;

Osamu Matsuzaki, Hanno, JP;

Assignee:

SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;

Attorney:

Nixon & Vanderhye P.C.

Primary Examiner:

Johannes P Mondt

Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/3735 (2013.01); H01L 23/492 (2013.01); H01L 23/49531 (2013.01); H01L 23/49833 (2013.01); H01L 24/40 (2013.01); H01L 25/065 (2013.01); H01L 25/074 (2013.01); H01L 2224/32135 (2013.01); H01L 2224/32141 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32151 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01);
Abstract

A semiconductor module according to one embodiment of the present invention includes: a first circuit board having thermal conductivity; a second circuit board having thermal conductivity and disposed opposing the first circuit board; a first semiconductor element joined to an opposing surface of the first circuit board opposing the second circuit board; a second semiconductor element joined to an opposing surface of the second circuit board opposing the first circuit board; and a connector electrically connecting the first semiconductor element and the second semiconductor element. The connector includes a portion which is sandwiched between the first semiconductor element and the second circuit board without through the second semiconductor element, and which is in contact with the first semiconductor element and the second circuit board.

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