The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
May. 09, 2016
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Naoki Takizawa, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;
Abstract
A semiconductor device includes a cooling plate made of metal, one or more laminated substrates each formed by laminating a circuit board, an insulating board, and a metal board, and one or more first semiconductor elements each made of a wide-band-gap semiconductor and disposed over outer peripheral edge portions of the circuit board. The metal board and the cooling plate are joined by the use of a joining material. As a result, even if temperature rises due to the operation of the one or more first semiconductor elements and heat radiation is not performed properly, the one or more first semiconductor elements operate stably.