The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Dec. 18, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Jeffrey A. West, Dallas, TX (US);

Kezhakkedath R. Udayakumar, Dallas, TX (US);

Eric H. Warninghoff, Allen, TX (US);

Alan G. Merriam, Plano, TX (US);

Rick A. Faust, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 21/31111 (2013.01); H01L 21/76814 (2013.01); H01L 21/76852 (2013.01); H01L 21/76861 (2013.01); H01L 21/76892 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01);
Abstract

An integrated circuit and method comprising an underlying metal geometry, a dielectric layer on the underlying metal geometry, a contact opening through the dielectric layer, an overlying metal geometry wherein a portion of the overlying metal geometry fills a portion of the contact opening, and an oxidation resistant barrier layer disposed between the underlying metal geometry and overlying metal geometry. The oxidation resistant barrier layer is formed of TaN or TiN with a nitrogen content of at least 20 atomic % and a thickness of at least 5 nm.


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